bym12-50 thru bym12-400 egl41a thru egl41g surface mount glass passivated ultrafast rectifier reverse voltage 50 to 400v forward current 1.0a solderable ends 1st band 0.022 (0.56) 0.018 (0.46) 0.205 (5.2) 0.185(4.7) d1= 0.105 0.095 (2.67) (2.41) d2 = d1 + 0 - 0.008 (0.20) 1st band denotes type and positive end (cathode) d2 do-213ab maximum ratings & thermal characteristics ratings at 25? ambient temperature unless otherwise specified. parameter symbol bym12-50 bym12-100 bym12-150 bym12-200 BYM12-300 bym12-400 unit fast efficient device: 1st band is green egl41a egl41b egl41c egl41d egl41f egl41g polarity color bands (2nd band) gray red pink orange brown yellow maximum repetitive peak reverse voltage v rrm 50 100 150 200 300 400 v maximum rms voltage v rms 35 70 105 140 210 280 v maximum dc blocking voltage v dc 50 100 150 200 300 400 v maximum average forward rectified current at t t = 75? i f(av) 1.0 a peak forward surge current 8.3ms single half sine-wave superimposed on rated load (jedec method) i fsm 30 a maximum thermal resistance (note 1, 2) r q ja 60 r q jt 30 ?/w operating junction and storage temperature range t j ,t stg 65 to +175 ? electrical characteristics ratings at 25? ambient temperature unless otherwise specified. parameter symbol bym12-50 bym12-100 bym12-150 bym12-200 BYM12-300 bym12-400 unit egl41a egl41b egl41c egl41d egl41f egl41g maximum instantaneous forward voltage at 1.0a v f 1.0 1.25 v maximum dc reverse current t a = 25? 5.0 at rated dc blocking voltage t a = 125? i r 50 m a max. reverse recovery time at i f = 0.5a, i r = 1.0a, i r r = 0.25a t rr 50 ns typical junction capacitance at 4.0v, 1mhz c j 20 14 pf notes: (1) thermal resistance from junction to ambient, 0.24 x 0.24?(6.0 x 6.0mm) copper pads to each terminal (2) thermal resistance from junction to terminal, 0.24 x 0.24?(6.0 x 6.0mm) copper pads to each terminal 6/22/00 features ?plastic package has underwriters laboratories flammability classification 94v-0 ?capable of meeting environmental standards of mil-s-19500 ?high temperature metallurgically bonded construction ?cavity-free glass passivated junction ?fast switching for high efficiency high temperature soldering guaranteed: 450?/5 seconds at terminals. complete device submersible temperature of 260? for 10 seconds in solder bath mechanical data case: jedec do-213ab, molded plastic over glass body terminals: plated terminals, solderable per mil-std-750, method 2026 polarity: two bands indicate cathode end ?1st band denotes device type and 2nd band denotes repetitive peak reverse voltage rating mounting position: any weight: 0.13 g., 0.0046 oz. patented* ? dimensions in inches and (millimeters) * glass-plastic encapsulation is covered by patent no. 3,996,602 and brazed-lead assembly to patent no. 3,930,306
ratings and characteristic curves (t a = 25? unless otherwise noted) bym12-50 thru bym12-400 egl41a thru egl41g 0 5.0 10 15 20 25 30 1 100 10 fig. 2 ?maximum non-repetitive peak forward surge current peak forward surge current (a) number of cycles at 60 h z 0 1.0 0 25 50 75 100 125 150 175 fig. 1 ?maximum forward current derating curve average forward rectified current (a) lead temperature ( c) 0.4 0.2 0.6 0.8 1.0 1.2 1.4 1.6 instantaneous forward voltage (v) fig. 3 ?typical instantaneous forward characteristics 020 60 40 100 80 fig. 4 ?typical reverse leakage characteristics instantaneous reverse leakage current ( m a) percent of rated peak reverse voltage (%) 0.5 resistive or inductive load 0.01 0.1 10 1 50 instantaneous forward current (a) t j = 25 c t j = 100 c t j = 150 c reverse voltage (v) junction capacitance (pf) 0.1 1 10 100 20 10 30 40 50 60 70 0 0.01 0.1 10 1 100 1,000 fig. 5 ?typical junction capacitance t j = t j max. 8.3ms single half sine-wave (jedec method) 1.8 t j = 25 c f = 1.0 mh z vsig = 50mvp-p t j = 25 c t j = 150 c pulse duration, sec. (t) transient thermal impedance ( c/w) 0.01 0.1 1 10 100 100 10 1 fig. 6 ?typical transient thermal impedance 0.1 pulse width = 300 m s 1% duty cycle egl41a ?egl41d egl41f ?egl41g egl41a ?egl41d egl41f ?egl41g
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